Low Temperature Drift Foil Network Resistance

Metal foil resistors are commonly used in electronic circuits for their high precision and stability, but they still suffer from a low-temperature drift phenomenon. This drift behavior is caused by changes in the resistive element's properties due to temperature changes over time. In this blog post, we will discuss the causes and mechanisms behind low-temperature drift in metal foil resistors.

First, it is important to understand that temperature changes affect the resistivity of metals used in resistive elements. Metals have a positive temperature coefficient of resistance, which means that their resistance increases as their temperature is increased. However, the rate at which resistance increases is not linear and depends on the type of metal used. For example, copper has a relatively low temperature coefficient, while nickel has a much higher temperature coefficient.

Low-temperature drift in metal foil resistors is usually caused by a mismatch between the thermal expansion coefficients of the resistive element and the substrate material. As the temperature decreases, the resistive element contracts more than the substrate material, which causes the element to strain and change its properties. This strain can lead to changes in resistivity, which result in changes in the value of the resistor.

Another cause of low-temperature drift is the presence of impurities in the resistive element. Impurities can alter the resistivity-temperature relationship of the metal, leading to non-linear changes in resistance as the temperature decreases.

To reduce the effects of low-temperature drift in metal foil resistors, manufacturers use several techniques. One approach is to select materials with similar thermal expansion coefficients for the resistive element and the substrate material. This reduces the strain on the resistive element and minimizes its drift behavior. Another technique is to use pure metals with low or zero impurities to minimize changes in resistivity with temperature.

In conclusion, low-temperature drift is a common phenomenon in metal foil resistors. It is caused by changes in the resistive element's properties due to temperature changes over time. Understanding the mechanisms behind low-temperature drift can help manufacturers design more stable and precise resistors, which are essential components in many electronic circuits.

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